SC-82AB 4 LEAD 2.0x1.25x0.95 mm, max with leads is 2.2x2.4x1.1mm
Pin Count:
4
Manufacturer Package Code:
419C-02
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Adjustable Threshold:
NO
Analog IC - Other Type:
VOLTAGE DETECTOR
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Length:
2 mm
Moisture Sensitivity Level:
1
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
4
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSOP
Package Equivalence Code:
TSOP4,.08
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Current-Max (Isup):
0.0036 mA
Supply Voltage-Max (Vsup):
10 V
Supply Voltage-Min (Vsup):
0.8 V
Supply Voltage-Nom (Vsup):
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
1.3 mm
Terminal Position:
DUAL
Threshold Voltage-Nom:
+3.5V
Time@Peak Reflow Temperature-Max (s):
30
Width:
1.25 mm
NCP305LSQ35T1G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other side of the board. This helps to reduce the thermal resistance and increase the power handling capability of the device.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power handling capability based on the ambient temperature. Additionally, ensure that the device is operated within its specified temperature range and that the junction temperature is kept below the maximum rated value.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device is operated within its specified temperature range and that the junction temperature is kept below the maximum rated value to prevent these issues.
The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Additionally, the device's thermal resistance and junction temperature should also be considered when calculating the power dissipation.
The NCP305LSQ35T1G has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage to the device. This includes using ESD-safe materials, grounding oneself before handling the device, and storing the device in a protective package.
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NCP305LSQ35T1G Overview
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