SC-82AB 4 LEAD 2.0x1.25x0.95 mm, max with leads is 2.2x2.4x1.1mm
Pin Count:
4
Manufacturer Package Code:
419C-02
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
onsemi
YTEOL:
0
Adjustable Threshold:
NO
Analog IC - Other Type:
VOLTAGE DETECTOR
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Length:
2 mm
Moisture Sensitivity Level:
1
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
4
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSOP
Package Equivalence Code:
TSOP4,.08
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Voltage-Max (Vsup):
10 V
Supply Voltage-Min (Vsup):
0.8 V
Supply Voltage-Nom (Vsup):
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
1.3 mm
Terminal Position:
DUAL
Threshold Voltage-Nom:
+3.7V
Time@Peak Reflow Temperature-Max (s):
30
Width:
1.25 mm
NCP305LSQ37T1G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device, ensure good thermal design and layout, and consider using a heat sink or thermal interface material to reduce the junction temperature.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
When selecting input and output capacitors, consider the device's operating frequency, output current, and voltage ripple requirements. A general rule of thumb is to use low-ESR capacitors with a voltage rating higher than the maximum input voltage and a capacitance value that meets the device's recommended requirements.
To minimize EMI and EMC issues, ensure proper PCB layout, use a shielded inductor, and consider adding EMI filters or common-mode chokes to the input and output lines. Additionally, follow the recommended layout guidelines for the device's pins and ensure that the device is properly decoupled.
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NCP305LSQ37T1G Overview
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