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NCP339BFCT2G - onsemi

Description: 1.2 V - 5.5 V operating range; 19 m RDS(ON) at 4.5 V; DC current up to 3 A; Output Auto-discharge for the NCP339B version; Reverse blocking function from OUT to IN

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PCB Footprints
NCP339BFCT2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.00x1.50_2020
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3D Models
NCP339BFCT2G - onsemi  - 3D model - BGA - WLCSP6, 1.00x1.50_2020
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NCP339BFCT2G Details

  • Manufacturer Part Number:

    NCP339BFCT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP6, 1.00x1.50

  • Package Description:

    WLCSP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    567FH

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B16

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.664 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NCP339BFCT2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP339BFCT2G involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance.
  • To ensure proper thermal management, make sure to provide adequate heat sinking, such as a thermal pad or heat sink, and ensure good airflow around the device. The maximum junction temperature (TJ) should not exceed 150°C.
  • The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (X5R or X7R dielectric) is recommended to minimize voltage ripple and ensure stable operation.
  • To troubleshoot issues with the NCP339BFCT2G, check the input voltage, output voltage, and current draw. Verify that the device is properly soldered and that the PCB layout is correct. Also, check for any signs of overheating, such as excessive temperature or thermal shutdown.
  • Yes, the NCP339BFCT2G is qualified for automotive and high-reliability applications, and meets the requirements of AEC-Q100. However, additional testing and validation may be required for specific applications.

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NCP339BFCT2G Overview

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