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NCP360MUTBG - onsemi

Description: These are Pb-Free Devices; Very Fast Protection, Up to 20 V, with 25 µA Current Consumption; On-chip PMOS Transistor; Overvoltage Lockout (OVLO); Undervoltage Lockout (UVLO); Alert FLAG Output; EN Enable Pin; Thermal Shutdown; 6-Lead UDFN 2 x 2 mm Package; TSOP-5 3 x 3 mm Package; Personal Digital Applications; MP3 Players; Computing

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PCB Footprints
NCP360MUTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - UDFN6 2x2, 0.65P CASE 517AB ISSUE C
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3D Models
NCP360MUTBG - onsemi  - 3D model - Small Outline No-lead - UDFN6 2x2, 0.65P CASE 517AB ISSUE C
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NCP360MUTBG Details

  • Manufacturer Part Number:

    NCP360MUTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN6, 2x2, 0.65P

  • Pin Count:

    6

  • Manufacturer Package Code:

    517AB

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • Built-in Protections:

    TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-XDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    1.5 µs

  • Width:

    2 mm

NCP360MUTBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause damage to the device.
  • Use ESD protection diodes and TVS diodes on the input pins, and consider adding a voltage regulator to regulate the input voltage.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the device as possible.

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NCP360MUTBG Overview

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