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NCP4302BDR2G - onsemi

Description: True Secondary Zero Current Detection; High Gate Drive Currents (2.5 A Source/Sink); Built-in voltage referfence (TL431 functionality); Current Sense Flexibility (MOSFET RDS(on) OR CS Resistor); Accurate Low Voltage Reference, 1%; Programmable Independent Secondary Side ton and toff Delays; Maximum Frequency of Operation up to 250 kHz; Self contained Control of Synchronous Rectifier in CCM, DCM, and QR Flyback Applications; Integrated controller and driver; wide operating voltage

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NCP4302BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-8-1+
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NCP4302BDR2G Details

  • Manufacturer Part Number:

    NCP4302BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8 Narrow Body-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    19 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    100 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    250 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP4302BDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal monitoring and shutdown. Additionally, consider using a thermally enhanced package or a device with a higher temperature rating.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection for the NCP4302BDR2G, follow proper handling and storage procedures, use ESD-protective packaging and materials, and implement ESD protection circuits or devices in the system design. Additionally, consider using a device with built-in ESD protection or a TVS diode for added protection.
  • When using the NCP4302BDR2G in a high-reliability or safety-critical application, consider implementing redundant systems, error detection and correction mechanisms, and fault-tolerant design principles. Additionally, ensure that the device is properly qualified and certified for the specific application, and follow relevant industry standards and guidelines.

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NCP4302BDR2G Overview

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