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NCP45790IMN24RTWG - onsemi

Description: Dual Integrated N-Channel MOSFETs; Ultra-Low On-Resistance; Soft-Start via Slew Rate Control; Reverse Current Protection; Advanced Controller with Charge Pump; Input Voltage Range 2 V to 24 V (30V Tolerant); Low Standby Current; No External Components Required; Enable Pins with CMOS Input Levels; Power Good Signaling; Fault Protection: Over Temperature; Fault Protection: Under Voltage Lockout; Fault Protection: Short-Circuit Protection; Fault Protection: Over Current Protection; Pb-Free Device

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NCP45790IMN24RTWG - onsemi - PCB symbol
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PCB Footprints
NCP45790IMN24RTWG - onsemi PCB footprint - Other - Other - DFN14 4x4, 0.5P CASE 506EK ISSUE A
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3D Models
NCP45790IMN24RTWG - onsemi - 3D model - Other - DFN14 4x4, 0.5P CASE 506EK ISSUE A
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NCP45790IMN24RTWG Details

  • Manufacturer Part Number:

    NCP45790IMN24RTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-14

  • Manufacturer Package Code:

    506EK

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-12-12

  • Manufacturer:

    onsemi

  • YTEOL:

    7.13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    S-PDSO-N14

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.16,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

NCP45790IMN24RTWG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum Tj rating can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. It's essential to ensure the device operates within the recommended temperature range.
  • Yes, the device is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure the device is properly qualified and validated for the specific application.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal design, and component selection. Also, verify that the device is operated within the recommended conditions and that the input voltage and current are within specifications.

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NCP45790IMN24RTWG Overview

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