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NCP4687DH18T1G - onsemi

Description: LDO Voltage Regulators 500MA LDO

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NCP4687DH18T1G - onsemi - PCB symbol
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PCB Footprints
NCP4687DH18T1G - onsemi PCB footprint - Other - Other - SOT−89, 5 LEAD CASE 528AB ISSUE O_1
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3D Models
NCP4687DH18T1G - onsemi - 3D model - Other - SOT−89, 5 LEAD CASE 528AB ISSUE O_1
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NCP4687DH18T1G Details

  • Manufacturer Part Number:

    NCP4687DH18T1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-89

  • Package Description:

    LEAD FREE, SOT-89, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    528AB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.41 V

  • Dropout Voltage1-Nom:

    0.27 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    2.8 V

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Length:

    4.5 mm

  • Line Regulation-Max:

    0.441%

  • Load Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    1.855 V

  • Output Voltage1-Min:

    1.745 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOF

  • Package Equivalence Code:

    TO-243

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    1.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.1%

  • Width:

    2.5 mm

NCP4687DH18T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and take corrective action if necessary.
  • Operating the device at a lower input voltage than the recommended 18V may affect its performance and efficiency. The device may not be able to deliver its full output current, and its voltage regulation may be compromised. It is recommended to operate the device within its specified input voltage range to ensure reliable operation.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output current, and output voltage levels using an oscilloscope or multimeter. Verify that the device is properly configured and that the output capacitor is of sufficient value and type. Also, check for any signs of overheating or thermal shutdown.
  • The NCP4687DH18T1G has built-in ESD protection and latch-up prevention measures, including internal ESD diodes and protection circuits. However, it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device.

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NCP4687DH18T1G Overview

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