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NCP5369MNR2G - onsemi

Description: Integrated Driver with High-Side and Low-Side MOSFETs

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NCP5369MNR2G Details

  • Manufacturer Part Number:

    NCP5369MNR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN40, 6x6, 0.5P

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    485AZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -10 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    50 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    25 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

NCP5369MNR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Also, ensure proper thermal design and heat sinking to prevent overheating.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7 μF to 10 μF is recommended to filter the input voltage and reduce noise.
  • Choose an output capacitor with low ESR and high ripple current rating. A ceramic capacitor (e.g., X5R or X7R) with a value of 10 μF to 22 μF is suitable for most applications.
  • Keep the high-current paths (e.g., VIN to LX) short and wide to minimize resistance and inductance. Use thick copper traces (e.g., 2 oz or 3 oz) and avoid sharp corners or narrow necks.

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NCP5369MNR2G Overview

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