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NCP562SQ18T1G - onsemi

Description: LDO Regulator, 80 mA, Ultra-Low Iq

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NCP562SQ18T1G - onsemi - PCB symbol
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PCB Footprints
NCP562SQ18T1G - onsemi PCB footprint - Other - Other - SC−82AB CASE 419C−02 ISSUE F
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3D Models
NCP562SQ18T1G - onsemi - 3D model - Other - SC−82AB CASE 419C−02 ISSUE F
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NCP562SQ18T1G Details

  • Manufacturer Part Number:

    NCP562SQ18T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-82AB 4 LEAD 2.0x1.25x0.95 mm, max with leads is 2.2x2.4x1.1mm

  • Pin Count:

    4

  • Manufacturer Package Code:

    419C-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.4 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    2.8 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.04%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.08 A

  • Output Voltage1-Max:

    1.854 V

  • Output Voltage1-Min:

    1.746 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    SOT-343R

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.25 mm

NCP562SQ18T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with multiple vias to the ground plane, and using a large copper area on the top and bottom layers to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings, and provide a stable input voltage within the specified range. Also, ensure that the input and output capacitors are properly selected and placed close to the device.
  • To prevent damage, handle the device by the body and avoid touching the pins or leads. Use an anti-static wrist strap or mat, and store the device in an anti-static bag or container. Avoid exposing the device to extreme temperatures, humidity, or physical stress.
  • To troubleshoot issues, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly biased and that the input and output capacitors are properly selected and placed. Check for any signs of physical damage or overheating, and consult the datasheet and application notes for guidance.
  • Yes, the device can be sensitive to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues. To minimize EMI/EMC issues, use a shielded layout, place the device away from noise sources, and use filtering components such as ferrite beads or chokes. Consult the datasheet and application notes for specific guidance.

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NCP562SQ18T1G Overview

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Part Image NCP562SQ18T1 onsemi

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