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NCP5662MN33R2G - onsemi

Description: ON Semiconductor NCP5662MN33R2G, LDO Voltage Regulator, 2A, 3.3 V ±2%, 2 → 9 Vin, 8-Pin DFN

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NCP5662MN33R2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - 8 PIN DFN 4x4 CASE 488AF-01 ISSUE C
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NCP5662MN33R2G - onsemi  - 3D model - Small Outline No-lead - 8 PIN DFN 4x4 CASE 488AF-01 ISSUE C
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NCP5662MN33R2G Details

  • Manufacturer Part Number:

    NCP5662MN33R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    8 PIN DFN, 4x4

  • Pin Count:

    8

  • Manufacturer Package Code:

    488AF

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.3 V

  • Dropout Voltage1-Nom:

    1 V

  • Input Voltage Absolute-Max:

    18 V

  • Input Voltage-Max:

    9 V

  • Input Voltage-Min:

    4.6 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    2 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.15,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    4 mm

NCP5662MN33R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A 4-layer PCB with a solid ground plane and a thermal relief pattern around the thermal pad is also recommended.
  • To ensure the device is properly biased during startup, make sure to provide a stable input voltage (VIN) and a valid enable signal (EN) before applying the output voltage (VOUT). Also, ensure that the output capacitor (COUT) is properly sized and placed close to the device to minimize voltage overshoot and ringing.
  • The maximum output current capability of the NCP5662MN33R2G is 3A, but it can be limited by the thermal performance of the PCB and the device's thermal derating. It's recommended to derate the output current based on the ambient temperature and the device's junction temperature.
  • The NCP5662MN33R2G has built-in OVP and UVLO features. For OVP, the device will shut down if the input voltage exceeds 6.5V. For UVLO, the device will shut down if the input voltage falls below 2.5V. You can also add external components to adjust the OVP and UVLO thresholds if needed.
  • The recommended input capacitor value is 10uF to 22uF, and it should be a low-ESR ceramic capacitor (X5R or X7R dielectric) placed close to the device's input pins. This helps to filter out input noise and ensure stable operation.

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