SC-82AB 4 LEAD 2.0x1.25x0.95 mm, max with leads is 2.2x2.4x1.1mm
Package Description:
SC-81AB, 4 PIN
Pin Count:
4
Manufacturer Package Code:
419C-02
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Adjustability:
FIXED
Dropout Voltage1-Max:
0.4 V
Dropout Voltage1-Nom:
0.25 V
Input Voltage Absolute-Max:
6.5 V
Input Voltage-Max:
6 V
Input Voltage-Min:
1.7 V
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Length:
2 mm
Line Regulation-Max:
0.015%
Load Regulation-Max:
0.04%
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
4
Operating Temperature TJ-Max:
125 °C
Operating Temperature TJ-Min:
-40 °C
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Current1-Max:
0.18 A
Output Voltage1-Max:
3.12 V
Output Voltage1-Min:
2.88 V
Output Voltage1-Nom:
3 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSOP
Package Equivalence Code:
TSOP4,.08
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Regulator Type:
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Seated Height-Max:
1.1 mm
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
TIN
Terminal Form:
GULL WING
Terminal Pitch:
1.3 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tolerance-Max:
2%
Width:
1.25 mm
NCP583SQ30T1G Frequently Asked Questions (FAQs)
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal status using the thermal monitoring pin (TMON).
The NCP583SQ30T1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protective package.
The device is not hermetically sealed, so it's not recommended for use in high-humidity environments. If operation in a humid environment is necessary, consider using a conformal coating or potting the device to protect it from moisture.
Follow the recommended soldering profile: peak temperature of 260°C, with a maximum time above 217°C of 30 seconds. Use a solder with a melting point above 217°C to prevent damage to the device.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NCP583SQ30T1G Overview
Use the download button to access the NCP583SQ30T1G schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like NCP58,
or try a keyword search, such as Linear Regulator ICs
