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NCP692MN18T2G - onsemi

Description: ON Semiconductor NCP692MN18T2G, LDO Voltage Regulator, 1A, 1.8 V ±2%, 1.5 → 6 Vin, 6-Pin DFN

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Symbol
NCP692MN18T2G - onsemi - PCB symbol
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PCB Footprints
NCP692MN18T2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN6 3*3 MM
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3D Models
NCP692MN18T2G - onsemi - 3D model - Small Outline No-lead - DFN6 3*3 MM
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NCP692MN18T2G Details

  • Manufacturer Part Number:

    NCP692MN18T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN 3x3x0.9mm, 0.95p

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AH

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.38 V

  • Dropout Voltage1-Nom:

    0.24 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    2.18 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.008%

  • Load Regulation-Max:

    0.03%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.12,38

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

NCP692MN18T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, ensuring good airflow, and minimizing power dissipation during operation.
  • The NCP692MN18T2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NCP692MN18T2G is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive-grade components. However, it's essential to follow the recommended operating conditions and ensure that the device is used within its specified parameters.
  • To troubleshoot issues with the device, start by reviewing the application circuit and ensuring that it's designed according to the recommended operating conditions. Check for proper power supply, input voltage, and output current. Use a thermal camera or thermometer to monitor the device temperature, and verify that the thermal design is adequate. If issues persist, consult the onsemi support team for further assistance.

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NCP692MN18T2G Overview

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