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NCP700BSN33T1G - onsemi

Description: Operating Input Voltage: 2.5V to 5.5V; Output Voltage Options: 1.8V, 2.8V, 3.0V, 3.3V; High Ripple Rejection Ratio: Typ. 82dB @ 1kHz; Ultra-Low Output Noise: Typ. 10µV from 10Hz to 100kHz; Stable with output capacitors as low as 1uF ; Low Sleep Mode Current: Max. 1µA; Active Discharge; Current Limit Protection; Thermal Shutdown Protection; These are Pb-Free Devices; Output Current Limit: Min. 200mA; No-Load Ground Current of Typ. 70µA ; Full-Load Ground Current of Typ. 75µA ; Output voltage accuracy: ±2.5%

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NCP700BSN33T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP
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NCP700BSN33T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP
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NCP700BSN33T1G Details

  • Manufacturer Part Number:

    NCP700BSN33T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.185 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.004%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    3.3825 V

  • Output Voltage1-Min:

    3.2175 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    1.5 mm

NCP700BSN33T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The NCP700BSN33T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NCP700BSN33T1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check for proper power supply decoupling, and ensure that the device is operated within the recommended voltage and current ranges. Consult the datasheet and application notes for troubleshooting guidelines.

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