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NCP715MX50TBG - onsemi

Description: LDO Regulator, 50 mA, Ultra-Low Iq

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NCP715MX50TBG - onsemi  - 3D model
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NCP715MX50TBG Details

  • Manufacturer Part Number:

    NCP715MX50TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN6 1.5X1.5, 0.5P

  • Pin Count:

    6

  • Manufacturer Package Code:

    711AE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.35 V

  • Dropout Voltage1-Nom:

    0.23 V

  • Input Voltage Absolute-Max:

    24 V

  • Input Voltage-Max:

    24 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    1.5 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max:

    0.03%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.09 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCP715MX50TBG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, and to operate the device within its specified temperature range. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • Yes, the NCP715MX50TBG is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using a robust process that ensures high reliability and low defect rates.
  • To troubleshoot issues with the device not turning on or off correctly, check the enable pin (EN) voltage and ensure it is within the specified range. Also, verify that the input voltage (VIN) is within the specified range and that the device is properly heat sunk. If the issue persists, consult the application note or contact onsemi support for further assistance.

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NCP715MX50TBG Overview

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