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NCP718BMT500TBG - onsemi

Description: Ultra−Low Quiescent Current typ. 4 µA over Temperature; Operating Input Voltage Range 2.5 V to 24 V; Adjustable and Fixed Version Available; High PSRR 60dB at 1kHz; Noise typ. 36 µVRMS from 100 Hz to 100 kHz; Stable with 1 µF output capacitor; Soft−start to Reduce Inrush Current and Overshoots; SOA Limiting for High Vin / High Iout – Static and Dynamic

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NCP718BMT500TBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - NCP718BMT500TBG
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NCP718BMT500TBG - onsemi  - 3D model - Small Outline No-lead - NCP718BMT500TBG
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NCP718BMT500TBG Details

  • Manufacturer Part Number:

    NCP718BMT500TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Manufacturer Package Code:

    511BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2018-11-08

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.395 V

  • Dropout Voltage1-Nom:

    0.26 V

  • Input Voltage Absolute-Max:

    24 V

  • Input Voltage-Max:

    24 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max:

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    2 mm

NCP718BMT500TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • When paralleling multiple devices, ensure that each device has its own decoupling capacitor and that the devices are synchronized to prevent oscillations. Also, consider the total current rating and thermal management when paralleling devices.

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