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NCP730BMTADJTBG - onsemi

Description: Output Voltage: 1.2 V to 24 V; Operating Input Voltage Range: 2.7 V to 38 V; Capable of Sourcing 200 mA Peak Output Current; Low Shutdown Current: 100 nA typ.; Very Low Quiescent Current: 1 uA typ.; Low Dropout: 290 mV typ. at 150 mA, 3.3 V Version; Output Voltage Accuracy ±1%; Power Good Output (Version B); Stable with Small 1 uF Ceramic Capacitors; Built−in Soft Start Circuit

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PCB Footprints
NCP730BMTADJTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN6 2x2, 0.65P CASE 511BR ISSUE C_2022
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NCP730BMTADJTBG - onsemi  - 3D model - Small Outline No-lead - WDFN6 2x2, 0.65P CASE 511BR ISSUE C_2022
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NCP730BMTADJTBG Details

  • Manufacturer Part Number:

    NCP730BMTADJTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Manufacturer Package Code:

    511BR

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Date Of Intro:

    2019-11-13

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.48 V

  • Dropout Voltage1-Nom:

    0.29 V

  • Input-Output Voltage Differential-Max:

    36.8 V

  • Input-Output Voltage Differential-Min:

    1 V

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Line Regulation-Max (%/V):

    0.2

  • Load Regulation-Max(%):

    0.4%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    24 V

  • Output Voltage1-Min:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCP730BMTADJTBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate within specifications. Ensure VIN is within the recommended range (2.7V to 5.5V) and VBIAS is set to 1.2V to 1.8V.
  • A 1uF to 10uF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
  • The POR and BOR features can be controlled using external resistors and capacitors. Consult the datasheet for specific component values and configuration guidelines.
  • The device has a thermal pad on the bottom side. Ensure good thermal contact between the thermal pad and the PCB or heat sink. Use thermal interface material (TIM) if necessary. Keep the device away from heat sources and ensure good airflow.

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