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NCP752BSN33T1G - onsemi

Description: Operating Input Voltage: 2.0V to 5.5V; Ultra-Low Output Noise: Typ. 11uVrms; Ultra-Low No-Load Ground Current of Typ. 10uVrms; Adaptive Ground Current Feature; Available Fixed Output Voltage Options: 0.8V to 3.5V; Enable/Shutdown Pin Function; Ultra-Low Shutdown Mode Current: Max. 1uA; Active Output Discharge; Ouput Short Circuit and Current Limit Protection; Thermal Shutdown Protection; Power-Good Output Flag; 2% Output Voltage Accuracy over load/line and temperature conditions

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PCB Footprints
NCP752BSN33T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP752BSN33T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP752BSN33T1G Details

  • Manufacturer Part Number:

    NCP752BSN33T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.13 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCP752BSN33T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding PCB area. A thermal via array can also be used to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, follow proper ESD handling procedures, use ESD-protective packaging and materials, and ensure that the device is properly grounded during assembly. Additionally, consider implementing ESD protection circuits or devices in the final product design.
  • The recommended storage and handling conditions for the device include storing it in a dry, cool place, away from direct sunlight and moisture. The device should be handled in an ESD-protected environment, and it's recommended to follow the manufacturer's specific storage and handling guidelines.

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