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NCP81062MNTWG - onsemi

Description: Adaptive Anti-Cross-Conduction; Integrated bootstrap diode; Zero Cross Detection; Output disable turns off both MOSFETs; Under-Voltage Lockout; PreOVP; Bi-directional Enable; Pb-Free, Halogen/BFR Free and RoHS compliant

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NCP81062MNTWG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 3x3, 0.5P
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NCP81062MNTWG - onsemi  - 3D model - Small Outline No-lead - DFN8 3x3, 0.5P
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NCP81062MNTWG Details

  • Manufacturer Part Number:

    NCP81062MNTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN-8

  • Package Description:

    DFN-8

  • Manufacturer Package Code:

    506BJ

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -10 °C

  • Output Characteristics:

    STANDARD

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.035 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    3 mm

NCP81062MNTWG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the bottom of the device.
  • To ensure reliable start-up and shutdown, it's recommended to use a soft-start circuit to limit the inrush current and to add a delay between the enable signal and the input voltage. Additionally, a voltage supervisor can be used to monitor the input voltage and ensure that the device is only enabled when the input voltage is within the recommended range.
  • When selecting output capacitors, consider the capacitance value, equivalent series resistance (ESR), and voltage rating. A higher capacitance value can help to reduce output voltage ripple, but may increase the start-up time. A low ESR can help to reduce energy losses, and the voltage rating should be higher than the maximum output voltage.
  • To optimize the device for low standby power consumption, consider using a low-quiescent-current (Iq) mode, disabling unnecessary features, and using a low-power mode during shutdown. Additionally, consider using a low-voltage input source and optimizing the output voltage to minimize power consumption.
  • Thermal design considerations include ensuring good airflow around the device, using a heat sink or thermal interface material, and keeping the device away from heat sources. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.

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