Please enter a minimum 3 letters or numbers
Technical Content
Part Image

NCP81071BZR2G - onsemi

Description: Pin compatible to the most popular existing industry standard dual MOSFET drivers; Input voltage from 4.5V to 20V; Both outputs can be paralleled for higher drive current; High current drive capability (+/- 5 A); TTL/CMOS compatible inputs, independent of supply voltage; Enable function incorporated for each driver

Download NCP81071BZR2G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
NCP81071BZR2G - onsemi - PCB symbol
click to zoom
PCB Footprints
NCP81071BZR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8 3x3 CASE 846AM ISSUE O
click to zoom
3D Models
NCP81071BZR2G - onsemi - 3D model - Small Outline Packages - MSOP8 3x3 CASE 846AM ISSUE O
click to zoom

NCP81071BZR2G Details

  • Manufacturer Part Number:

    NCP81071BZR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP-8 EP

  • Package Description:

    MSOP-8

  • Manufacturer Package Code:

    846AM

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.029 µs

  • Turn-on Time:

    0.029 µs

  • Width:

    3 mm

NCP81071BZR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the thermal pad is connected to a solid ground plane.
  • To ensure reliable start-up of the device, ensure that the input voltage rises monotonically and does not droop during start-up. A soft-start circuit can be used to limit the inrush current and ensure a reliable start-up. Additionally, ensure that the input voltage is within the recommended operating range.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • To optimize the output filter design, use a combination of capacitors and inductors to filter out high-frequency noise and ripple. A good starting point is to use a 10uF ceramic capacitor and a 1uH inductor in series. The output filter should be designed to provide a damping ratio of 0.5 to 1.5 to ensure stability.
  • A good thermal management strategy involves using a heat sink with a thermal conductivity of at least 1 W/m-K, and applying a thermal interface material with a thermal conductivity of at least 5 W/m-K. Ensure that the heat sink is properly attached to the device using a screw or clip, and that the thermal interface material is evenly applied.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NCP81071BZR2G Overview

Use the download button to access the NCP81071BZR2G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCP81, or try a keyword search, such as MOSFET Drivers

Parts related to NCP81071BZR2G

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑