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NCP81155MNTXG - onsemi

Description: Gate Drivers MOSFET DRIVER

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NCP81155MNTXG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 3X3 0.5P CASE 506BJ-01
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NCP81155MNTXG - onsemi  - 3D model - Small Outline No-lead - DFN8 3X3 0.5P CASE 506BJ-01
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NCP81155MNTXG Details

  • Manufacturer Part Number:

    NCP81155MNTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    DFN-8

  • Manufacturer Package Code:

    506BJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.78

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -10 °C

  • Output Characteristics:

    STANDARD

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.03 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    3 mm

NCP81155MNTXG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use the onsemi Power Architect tool to configure the device for your specific application. The tool provides a graphical user interface to select the desired configuration and generates the necessary code for the device.
  • The maximum ambient temperature range for the NCP81155MNTXG is -40°C to 125°C. However, the device can operate at a higher temperature range with derating.
  • Yes, the NCP81155MNTXG is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability.
  • Use the onsemi support resources, such as the datasheet, application notes, and FAQs. You can also contact onsemi's technical support team for assistance.

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NCP81155MNTXG Overview

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