A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Use the onsemi Power Architect tool to configure the device for your specific application. The tool provides a graphical user interface to select the desired configuration and generates the necessary code for the device.
The maximum ambient temperature range for the NCP81155MNTXG is -40°C to 125°C. However, the device can operate at a higher temperature range with derating.
Yes, the NCP81155MNTXG is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability.
Use the onsemi support resources, such as the datasheet, application notes, and FAQs. You can also contact onsemi's technical support team for assistance.
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NCP81155MNTXG Overview
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