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NCP81599MNTXG - onsemi

Description: I2C interface; Switching frequency from 150 kHz to 1200 kHz; Slew rate control during transition; Supports USB-PD requirements; Overvoltage and overcurrent protection; 4.5 V to 28 V operating range

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NCP81599MNTXG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN32 5x5, 0.5P
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NCP81599MNTXG - onsemi  - 3D model - Quad Flat No-Lead - QFN32 5x5, 0.5P
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NCP81599MNTXG Details

  • Manufacturer Part Number:

    NCP81599MNTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN-32

  • Package Description:

    QFN-32

  • Manufacturer Package Code:

    485CE

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +3.96V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

NCP81599MNTXG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Use a pi-filter configuration with a common-mode choke, and ensure the output filter components are placed close to the device. Follow the recommended layout guidelines in the datasheet.
  • The device can tolerate ±10% input voltage deviation from the nominal input voltage. Exceeding this may affect performance and reliability.
  • Ensure a monotonic power-up and power-down sequence, and add a soft-start circuit to limit inrush current. Follow the recommended power-up and power-down timing in the datasheet.
  • A thermal interface material with a thermal conductivity of at least 1 W/m-K is recommended. Examples include thermal tapes, thermal greases, or graphite pads.

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NCP81599MNTXG Overview

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