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NCS20061SN2T1G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 3 MHz; High Slew Rate: 1.2 V/?s at VS = 1.8 V; Low Supply Current: 125 µ?A per Channel at VS = 1.8 V; Low Input Bias Current: 1 pA Typical; Wide Temperature Range: −40 to 125°C; Available in a Variety of Packages; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NCS20061SN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - ---SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L
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3D Models
NCS20061SN2T1G - onsemi  - 3D model - SOT23 (5-Pin) - ---SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L
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NCS20061SN2T1G Details

  • Manufacturer Part Number:

    NCS20061SN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Package Description:

    SOT-23, 5 PIN

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-04-08

  • Manufacturer:

    onsemi

  • YTEOL:

    6.67

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.5 mm

NCS20061SN2T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the soldering iron is set to a low temperature and the device is not exposed to excessive heat or mechanical stress during the soldering process.

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