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NCS20081SN2T1G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 1.2 MHz; High Slew Rate: 0.4 V/µs at VS = 1.8 V; Low Supply Current: 42 µA per Channel at VS = 1.8 V; Low Input Bias Current: 1 pA Typical; Wide Temperature Range: −40 to 125°C; Available in a Variety of Packages; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NCS20081SN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE N_2023
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NCS20081SN2T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE N_2023
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NCS20081SN2T1G Details

  • Manufacturer Part Number:

    NCS20081SN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.67

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.0011 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    25 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    19952.62

  • Wideband:

    NO

  • Width:

    1.5 mm

NCS20081SN2T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material (TIM) to improve heat transfer between the IC and the heat sink.
  • Exceeding the maximum TJ rating can lead to reduced reliability, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to maintain its performance and lifespan.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Also, follow proper handling and storage procedures to prevent ESD damage.
  • Use a reflow soldering process with a peak temperature of 260°C or less to prevent damage to the device. For rework, use a hot air rework station with a temperature-controlled heat source to avoid overheating the device.

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