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NCS20082DMR2G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 1.2 MHz; High Slew Rate: 0.4 V/µs at VS = 1.8 V; Low Supply Current: 42 µA per Channel at VS = 1.8 V; Low Input Bias Current: 1 pA Typical; Wide Temperature Range: −40 to 125°C; Available in a Variety of Packages; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

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NCS20082DMR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MICRO8 CASE 846A-02 ISSUE H
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NCS20082DMR2G - onsemi  - 3D model - Small Outline Packages - MICRO8 CASE 846A-02 ISSUE H
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NCS20082DMR2G Details

  • Manufacturer Part Number:

    NCS20082DMR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro8

  • Manufacturer Package Code:

    846A-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.0011 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    25 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    19952.62

  • Wideband:

    NO

  • Width:

    3 mm

NCS20082DMR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Yes, but ensure the device is properly sealed and conformal coated to prevent moisture ingress. Also, follow the recommended storage and handling procedures to prevent moisture absorption.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check the power supply voltage, input signal integrity, and output loading. Consult the datasheet and application notes for troubleshooting guidelines.

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