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NCS21872DMR2G - onsemi

Description: Low Input Offset Voltage of 45 µV; Low Input Offset Drift over Temperature and Time of 0.4 µV/°C; Automotive AEC-Q100 Qualified; Low Supply Current: 17 µA (typ at 3.3 V); Rail−to−Rail Input and Output; Excellent low frequency (< 1kHz) noise

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NCS21872DMR2G - onsemi  - 3D model
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NCS21872DMR2G Details

  • Manufacturer Part Number:

    NCS21872DMR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro8

  • Package Description:

    MICRO-8

  • Manufacturer Package Code:

    846A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.0004 µA

  • Common-mode Reject Ratio-Min:

    102 dB

  • Common-mode Reject Ratio-Nom:

    118 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0008 µA

  • Input Offset Voltage-Max:

    45 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.05 V/us

  • Supply Current-Max:

    0.09 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    270

  • Voltage Gain-Min:

    199526.23149

  • Wideband:

    NO

  • Width:

    3 mm

NCS21872DMR2G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent premature failure.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to prevent damage from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • Ensure that the power supplies are sequenced correctly to prevent damage to the device. The recommended power-up sequence is VCC, then VIN. Also, ensure that the input voltage is stable and within the recommended range before applying power to the device.

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NCS21872DMR2G Overview

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