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NCS21912DR2G - onsemi

Description: Low Offset Drift:0.085 µV/°C max; Supply Voltage: 4 to 36V; Quiescent Current: 570 µA Max; Low Noise: 22 nV/√Hz typical; Gain-Bandwidth Product: 2 MHz typical; Rail−to−Rail Output; Low Offset Voltage: 25 µV Max; Integrated EMI filters

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NCS21912DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC
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NCS21912DR2G - onsemi  - 3D model - Small Outline Packages - 8-Pin SOIC
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NCS21912DR2G Details

  • Manufacturer Part Number:

    NCS21912DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.0005 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0035 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    1.14 mA

  • Supply Voltage Limit-Max:

    40 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    1778279

  • Wideband:

    NO

  • Width:

    3.9 mm

NCS21912DR2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent premature failure.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Ensure that the ESD protection devices are rated for the maximum voltage and current of the application.
  • Use a reflow soldering process with a peak temperature of 260°C or less to prevent damage to the device. Avoid using wave soldering or hand soldering, as these methods can cause damage to the device. For rework, use a hot air rework station with a temperature-controlled heat source.

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NCS21912DR2G Overview

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