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NCS333ASQ3T2G - onsemi

Description: Low Offset Voltage: 10 µV max (NCS333), 30µV max (NCV333A); Zero Drift Architecture with offset drift as low as 0.07 µV/°C max; Quiescent Current: 17 µA Typical at 3.3 V Supply; Supply Voltage: 1.8 V to 5.5 V; Rail−to−Rail Input and Output Voltage; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

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NCS333ASQ3T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - NCS333ASQ3T2G-1
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NCS333ASQ3T2G - onsemi  - 3D model - SOT23 (5-Pin) - NCS333ASQ3T2G-1
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NCS333ASQ3T2G Details

  • Manufacturer Part Number:

    NCS333ASQ3T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    106 dB

  • Common-mode Reject Ratio-Nom:

    123 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    45 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    199526.231

  • Wideband:

    NO

  • Width:

    1.25 mm

NCS333ASQ3T2G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • Use a 10uF to 22uF decoupling capacitor with a voltage rating of 10V or higher, placed as close as possible to the device's power pins. Additional capacitors may be required depending on the specific application and PCB layout.

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NCS333ASQ3T2G Overview

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