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NCS4333DTBR2G - onsemi

Description: Low Offset Voltage: 30 ?µ?V max for NCS4333; Zero Drift: 0.07 ?µ?V/°C max; Quiescent Current per Channel: 17 ?µ?A Typical at 3.3 V Supply; Low Noise: 1.1 µ?Vpp, 0.1 Hz to 10 Hz; Supply Voltage: 1.8 V to 5.5 V; Rail−to−Rail Input and Output

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NCS4333DTBR2G - onsemi - PCB symbol
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PCB Footprints
NCS4333DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−14 WB CASE 948G ISSUE C_1
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NCS4333DTBR2G - onsemi - 3D model - Small Outline Packages - TSSOP−14 WB CASE 948G ISSUE C_1
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NCS4333DTBR2G Details

  • Manufacturer Part Number:

    NCS4333DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Date Of Intro:

    2019-11-11

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Common-mode Reject Ratio-Nom:

    118 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0008 µA

  • Input Offset Voltage-Max:

    30 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    199526.23

  • Wideband:

    NO

NCS4333DTBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a heat sink or thermal plane, and ensure good airflow around the device. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink or thermal plane.
  • The recommended input capacitors are 10uF to 22uF X7R or X5R ceramic capacitors, and the recommended output capacitors are 10uF to 47uF X7R or X5R ceramic capacitors. The capacitor values may vary depending on the specific application and operating conditions.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors. Ensure that the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback resistors are correctly connected and of the recommended values.
  • The recommended soldering profile for the NCS4333DTBR2G is a reflow profile with a peak temperature of 260°C to 270°C, a dwell time above 250°C of 30 seconds to 60 seconds, and a ramp rate of 3°C per second to 4°C per second.

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NCS4333DTBR2G Overview

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