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NCT72CMNR2G - onsemi

Description: ON Semiconductor NCT72CMNR2G, Temperature Monitor Maximum of +150 °C ±1°C Serial-I2C, SMBus, 8-Pin DFN

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NCT72CMNR2G - onsemi - PCB symbol
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PCB Footprints
NCT72CMNR2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 3x3, 0.5P
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3D Models
NCT72CMNR2G - onsemi - 3D model - Small Outline No-lead - DFN8 3x3, 0.5P
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NCT72CMNR2G Details

  • Manufacturer Part Number:

    NCT72CMNR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN8 3x3, 0.5P

  • Pin Count:

    8

  • Manufacturer Package Code:

    506BJ

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Accuracy-Max (Cel):

    2.5 Cel

  • Body Breadth:

    3 mm

  • Body Height:

    0.875 mm

  • Body Length or Diameter:

    3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    8

  • Number of Terminals:

    8

  • Operating Current-Max:

    0.35 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Output Voltage-Min:

    0.4 V

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Termination Type:

    SOLDER

NCT72CMNR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to maintain reliability.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and ensure that the PCB is designed with ESD protection in mind. Also, follow proper handling and storage procedures to prevent ESD damage.
  • For high-frequency operation, ensure that the PCB is designed with low inductance and capacitance, and that the device is properly decoupled. Also, consider using a low-ESR capacitor and a ferrite bead or choke to filter out high-frequency noise.

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NCT72CMNR2G Overview

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