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NCV20061SN2T1G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 3 MHz; High Slew Rate: 1.2 V/?s at VS = 1.8 V; Low Supply Current: 125 µ?A per Channel at VS = 1.8 V; Low Input Bias Current: 1 pA Typical; Wide Temperature Range: −40 to 125°C; Available in a Variety of Packages; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NCV20061SN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 Case 483 Issue M
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NCV20061SN2T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 Case 483 Issue M
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NCV20061SN2T1G Details

  • Manufacturer Part Number:

    NCV20061SN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Package Description:

    SOT-23, 5 PIN

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-04-08

  • Manufacturer:

    onsemi

  • YTEOL:

    6.67

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.5 mm

NCV20061SN2T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure good thermal design, and consider using a heat sink if necessary.
  • The NCV20061SN2T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • To troubleshoot issues with output voltage regulation, check the input voltage, output load, and feedback resistors. Ensure that the device is properly configured, and that the output voltage is within the specified range. Also, verify that the device is not overheating.
  • For PCB assembly and soldering, follow the recommended reflow soldering profile, and ensure that the device is properly aligned and secured to the PCB. Avoid overheating the device during soldering, and use a soldering iron with a temperature-controlled tip.

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