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NCV20062DTBR2G - onsemi

Description: These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; Available in a Variety of Packages; Wide Temperature Range: −40 to 125°C; Low Input Bias Current: 1 pA Typical; Low Supply Current: 125 µ?A per Channel at VS = 1.8 V; High Slew Rate: 1.2 V/?s at VS = 1.8 V; Wide Bandwidth: 3 MHz; Wide Supply Range: 1.8 to 5.5 V; Rail−to−Rail Input and Output

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NCV20062DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - **TSzzSOP8 CASE 948S IzzzSSUE C
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NCV20062DTBR2G Details

  • Manufacturer Part Number:

    NCV20062DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-8

  • Package Description:

    TSSOP-14

  • Manufacturer Package Code:

    948S-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Date Of Intro:

    2016-04-08

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

NCV20062DTBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCV20062DTBR2G involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it away from sensitive components can help reduce EMI.
  • To ensure the NCV20062DTBR2G operates within the recommended junction temperature range, use a thermal pad or heat sink, and ensure good airflow around the device. Also, avoid overheating the device during soldering and rework.
  • Exceeding the maximum ratings of the NCV20062DTBR2G can lead to reduced reliability, permanent damage, or even device failure. It's essential to operate the device within the recommended specifications to ensure reliable operation.
  • To troubleshoot issues with the NCV20062DTBR2G, start by checking the input voltage, output voltage, and current. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for voltage ripple or oscillations. If the issue persists, consult the datasheet and application notes or contact onsemi support.
  • The NCV20062DTBR2G is a commercial-grade device, and its use in high-reliability or safety-critical applications should be carefully evaluated. onsemi provides additional resources and support for such applications, including failure-in-time (FIT) rates and fault tree analysis. Consult with onsemi support and follow relevant industry standards and guidelines.

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NCV20062DTBR2G Overview

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