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NCV20084DTBR2G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 1.2 MHz; Low Input Offset Voltage: 3.5mV; Low Supply Current: 42 µA per Channel at VS = 1.8 V; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NCV20084DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−14 WB
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NCV20084DTBR2G - onsemi  - 3D model - Small Outline Packages - TSSOP−14 WB
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NCV20084DTBR2G Details

  • Manufacturer Part Number:

    NCV20084DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Manufacturer Package Code:

    948G

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Date Of Intro:

    2018-12-21

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.0011 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    25 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.28 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    19952.62

  • Wideband:

    NO

  • Width:

    4.4 mm

NCV20084DTBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable heat sink, and ensure good airflow. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink, and ensure that the device is operated within its specified temperature range.
  • The recommended soldering conditions for NCV20084DTBR2G are: peak temperature of 260°C, time above 217°C of 30 seconds, and a soldering time of 10 seconds. It's also recommended to use a soldering iron with a temperature range of 350°C to 400°C.
  • To handle ESD protection during handling and assembly, it's recommended to use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or leads, and use ESD-protected packaging and storage materials.
  • The recommended storage conditions for NCV20084DTBR2G are: temperature range of -40°C to 125°C, humidity of 60% or less, and protection from direct sunlight and moisture. It's also recommended to store the device in its original packaging or in a sealed bag with desiccant.

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