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NCV20091SQ3T2G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 350 kHz; High Slew Rate: 0.15 V/µs at V= 1.8 V; Low Supply Current: 20 µA per Channel at VS = 1.8 V; Low Input Bias Current: 1 pA Typical; Wide Temperature Range: −40 to 125°C; Available in a Variety of Packages; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NCV20091SQ3T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC70_1
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NCV20091SQ3T2G - onsemi  - 3D model - SOT23 (5-Pin) - SC70_1
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NCV20091SQ3T2G Details

  • Manufacturer Part Number:

    NCV20091SQ3T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Bias Current-Max (IIB) @25C:

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0011 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    0.033 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    17782.79

  • Wideband:

    NO

  • Width:

    1.25 mm

NCV20091SQ3T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within its specified temperature range to maintain its performance and longevity.
  • To handle ESD protection during handling and assembly, follow standard ESD precautions such as using an ESD wrist strap, ESD mat, and ESD-safe packaging materials. Ensure that the device is handled in a static-controlled environment, and avoid touching the device pins or leads.
  • The recommended soldering conditions for the NCV20091SQ3T2G involve using a soldering iron with a temperature of 260°C (500°F) or less, and a soldering time of 3 seconds or less. It's also essential to use a solder with a melting point of 180°C (356°F) or higher.

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NCV20091SQ3T2G Overview

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