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NCV21872DMR2G - onsemi

Description: Low Input Offset Voltage of 45 µV; Low Input Offset Drift over Temperature and Time of 0.4 µV/°C; Automotive AEC-Q100 Qualified; Low Supply Current: 17 µA (typ at 3.3 V); Rail−to−Rail Input and Output; Excellent low frequency (< 1kHz) noise

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NCV21872DMR2G - onsemi - PCB symbol
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PCB Footprints
NCV21872DMR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Micro8
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NCV21872DMR2G - onsemi - 3D model - Small Outline Packages - Micro8
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NCV21872DMR2G Details

  • Manufacturer Part Number:

    NCV21872DMR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro8

  • Package Description:

    MICRO-8

  • Manufacturer Package Code:

    846A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.0004 µA

  • Common-mode Reject Ratio-Min:

    102 dB

  • Common-mode Reject Ratio-Nom:

    118 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0008 µA

  • Input Offset Voltage-Max:

    45 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.05 V/us

  • Supply Current-Max:

    0.09 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    270

  • Voltage Gain-Min:

    199526.23149

  • Wideband:

    NO

  • Width:

    3 mm

NCV21872DMR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues related to overvoltage protection (OVP) and undervoltage protection (UVP), check the input voltage levels, ensure that the device is properly configured, and verify that the OVP and UVP thresholds are set correctly. Also, review the device's fault detection and reporting mechanisms to identify the root cause of the issue.
  • To ensure electromagnetic compatibility (EMC) and minimize electromagnetic interference (EMI), follow proper PCB layout and design guidelines, use shielding and filtering components as necessary, and ensure that the device is operated within its specified frequency range. Additionally, consider using a common-mode choke to reduce EMI emissions.

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NCV21872DMR2G Overview

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