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NCV2393DR2G - onsemi

Description: Extremely Low Supply Current: 6 µA Typical Per Channel; Wide Supply Range: 2.7 to 16 V; Extremely Low Input Bias Current: 1 pA Typical; Extremely Low Input Offset Current: 1 pA Typical; Input Common Mode Range Includes VSS; High Input Impedance: 1012 Ω; Pin-to-Pin Compatibility with Dual Bipolar LM393; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP Capable

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PCB Footprints
NCV2393DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 NB CASE 751−07 ISSUE AK_2020
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NCV2393DR2G - onsemi  - 3D model - Small Outline Packages - SOIC−8 NB CASE 751−07 ISSUE AK_2020
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NCV2393DR2G Details

  • Manufacturer Part Number:

    NCV2393DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 8, 150 mils

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.65

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.0006 µA

  • Input Offset Voltage-Max:

    14000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    16 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV2393DR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the PCB.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • The NCV2393DR2G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NCV2393DR2G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within its recommended operating conditions and that the system design meets the required safety and reliability standards.
  • Use a thermal imaging camera or thermocouple to monitor the device's temperature. Check the device's pinout and connections for any signs of damage or corrosion. Use a logic analyzer or oscilloscope to debug the device's operation and identify any signal integrity issues.

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