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NCV272DMR2G - onsemi

Description: Wide Bandwidth: 3 MHz; Wide Power Supply Range: 2.7 to 36V; Low Supply Current: 416 µA; Rail to Rail Output

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NCV272DMR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Micro8 CASE 846A−02 ISSUE J
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NCV272DMR2G - onsemi  - 3D model - Small Outline Packages - Micro8 CASE 846A−02 ISSUE J
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NCV272DMR2G Details

  • Manufacturer Part Number:

    NCV272DMR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro8

  • Manufacturer Package Code:

    846A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2020-04-28

  • Manufacturer:

    onsemi

  • YTEOL:

    5.82

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    102 dB

  • Common-mode Reject Ratio-Nom:

    125 dB

  • Input Offset Current-Max (IIO):

    0.000075 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2.7 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    63095.73445

  • Wideband:

    NO

  • Width:

    3 mm

NCV272DMR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range.
  • To protect the device from ESD, handle the device by the body or use an ESD wrist strap, use ESD-safe packaging and storage, and ensure that the PCB design includes ESD protection components such as TVS diodes or ESD arrays.
  • For high-reliability applications, consider using a device with a higher temperature rating, ensure that the device is operated within its specified parameters, and implement robust testing and validation procedures to ensure the device meets the required reliability standards.

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NCV272DMR2G Overview

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