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NCV2904DR2G - onsemi

Description: Short Circuit Protected Outputs; Low Input Bias Currents; Single Supply Operation: 3.0 V to 32 V ; Single and Split Supply Operation; Internally Compensated; ESD Clamps on the Inputs Increase Ruggedness of the Device without Affecting Operation; True Differential Input Stage; Common Mode Range Extends to Negative Supply; Pb-Free Packages are Available

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NCV2904DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07 ISSUE AK
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NCV2904DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07 ISSUE AK
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NCV2904DR2G Details

  • Manufacturer Part Number:

    NCV2904DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.05 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    3 mA

  • Supply Voltage Limit-Max:

    32 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    15000

  • Wideband:

    NO

  • Width:

    3.9 mm

NCV2904DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of any components or traces.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, ensure that the PCB is designed to withstand high temperatures, and that all components are rated for the operating temperature range.
  • The recommended soldering conditions for the NCV2904DR2G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C to 220°C.
  • To handle ESD protection for the NCV2904DR2G, ensure that all handling and assembly procedures follow ESD-safe practices. Use ESD-protective packaging, wrist straps, and mats, and ground all equipment and personnel. Avoid touching the device's pins or leads, and use ESD-protected tools and equipment.
  • The recommended storage conditions for the NCV2904DR2G are: temperature range of -40°C to 150°C, humidity of 60% or less, and protection from direct sunlight and moisture. Store the devices in their original packaging or in a dry, ESD-protected environment.

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NCV2904DR2G Overview

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