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NCV33174DTBR2G - onsemi

Description: Large Output Voltage Swing: -14.2 V to +14.2 V (with +/-15 V Supplies); Low Supply Current: 180 µA (Per Amplifier); Output Short Circuit Protection; Excellent Gain Margin: 15 dB; Low Input Offset Voltage: 2.0 mV; Wide Supply Operating Range: 3.0 V to 44 V or +/-1.5 V to +/- 22 V; Wide Input Common Mode Range, Including Ground (VEE); Excellent Phase Margin: 60 C°; ESD Diodes Provide Input Protection for Dual and Quad; High Slew Rate: 2.1 V/µs; Low Total Harmonic Distortion: 0.03%; Wide Bandwidth: 1.8 MHz; La

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NCV33174DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−14 WB CASE 948G ISSUE C
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NCV33174DTBR2G - onsemi  - 3D model - Small Outline Packages - TSSOP−14 WB CASE 948G ISSUE C
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NCV33174DTBR2G Details

  • Manufacturer Part Number:

    NCV33174DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    1.6 V/us

  • Slew Rate-Nom:

    2.1 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1800

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    4.4 mm

NCV33174DTBR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum of 2 oz copper thickness, and ensuring good thermal conductivity to the surrounding copper area. A thermal via array under the device can also help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to reduce the thermal resistance between the device and the surrounding environment.
  • The NCV33174DTBR2G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2 kV human body model (HBM) and 200 V machine model (MM) ESD protection is recommended.
  • Yes, the NCV33174DTBR2G is AEC-Q100 qualified, which makes it suitable for use in automotive applications. However, it is essential to ensure that the device is used within the recommended operating conditions and that the system design meets the required automotive standards.
  • The recommended soldering profile for the NCV33174DTBR2G involves a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. It is essential to follow the recommended soldering profile to prevent damage to the device.

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NCV33174DTBR2G Overview

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