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NCV451AMNWTBG - onsemi

Description: 0,75V - 5.5V Operating Range; 21mΩ N MOSFET from 3.6V to 5.5V; DC Current Up to 3A; Output Auto-Discharge; DFNW6 2.2 x 2 mm, 0.65 pitch

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NCV451AMNWTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW6 2.0x2.2, 0.65P
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NCV451AMNWTBG - onsemi  - 3D model - Small Outline No-lead - DFNW6 2.0x2.2, 0.65P
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NCV451AMNWTBG Details

  • Manufacturer Part Number:

    NCV451AMNWTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-6

  • Package Description:

    DFN-6

  • Manufacturer Package Code:

    507AF

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Built-in Protections:

    TRANSIENT

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-N6

  • Length:

    2.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    0.75 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCV451AMNWTBG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range.
  • The NCV451AMNWTBG has built-in ESD protection, but it's still important to follow proper ESD handling and assembly procedures to prevent damage. Use ESD-safe materials and equipment, and ensure that the device is handled and stored in an ESD-protected environment.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and feedback resistors. Ensure that the feedback resistors are correctly selected and that the output voltage is within the specified range. Also, check for any signs of overheating or excessive current draw.
  • When paralleling multiple devices for higher current output, ensure that each device has its own input capacitor and that the output capacitors are properly sized. Also, ensure that the devices are properly synchronized and that the output currents are properly balanced.

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NCV451AMNWTBG Overview

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