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NCV47821PAAJR2G - onsemi

Description: Adjustable Outputs: 3.3 V to 20 V ±3% Output Voltage; Output Current per Channel: up to 200 mA; Two Independent Enable Inputs (3.3 V Logic Compatible); Adjustable Current Limits: up to 300 mA; Diagnostic Features: Short to Battery and Open Load detection in OFF State Internal Components for OFF State Diagnostics Open Collector Flag Output; Protection: Current Limitation, Thermal Shutdown, Reverse Input Voltage

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NCV47821PAAJR2G Details

  • Manufacturer Part Number:

    NCV47821PAAJR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 EP

  • Package Description:

    TSSOP-14

  • Manufacturer Package Code:

    948AW

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Dropout Voltage2-Max:

    0.5 V

  • Input-Output Voltage Differential-Max:

    20 V

  • Input-Output Voltage Differential-Min:

    1.1 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Line Regulation-Max (%/V):

    0.028

  • Load Regulation-Max(%):

    1.4%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Outputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Current2-Max:

    0.3 A

  • Output Voltage1-Max:

    20.6 V

  • Output Voltage1-Min:

    3.201 V

  • Output Voltage2-Max:

    20.6 V

  • Output Voltage2-Min:

    3.201 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

NCV47821PAAJR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To protect the device from EOS, use a suitable voltage regulator, add transient voltage suppression diodes, and ensure that the input voltage is within the recommended range. Additionally, consider using a fuse or a current limiter to prevent excessive current surges.
  • To prevent damage, store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the pins or electrical connections. Use an anti-static wrist strap or mat when handling the devices to prevent electrostatic discharge.

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