Description:Two Independent Enable Inputs (3.3 V Logic Compatible); Adjustable Current Limits: up to 350 mA; Diagnostic Features: Short to Battery and Open Load detection in OFF State Internal Components for OFF State Diagnostics Open Collector Flag Output; Output Current per Channel: up to 250 mA; Protection: Current Limitation Thermal Shutdown Reverse Input Voltage and Reverse Bias Voltage Reduced Reverse Bias Current; AEC−Q100 Grade 1 Qualified and PPAP Capable; Reduced Inrush Current (current value set by external
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.2 mm
Supply Voltage-Max:
40 V
Supply Voltage-Min:
4.4 V
Supply Voltage-Nom:
13.5 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
NCV47823PAAJR2G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system.
The NCV47823PAAJR2G has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and use a suitable bypass capacitor to prevent voltage spikes.
Yes, the NCV47823PAAJR2G is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive-grade devices. However, it's essential to follow the recommended operating conditions and ensure that the device is used within its specified parameters.
Follow the recommended soldering and assembly procedures outlined in the onsemi application note AND8033/D. This includes using a suitable soldering temperature profile, ensuring good solder wetting, and avoiding excessive mechanical stress during assembly.
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NCV47823PAAJR2G Overview
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