SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Seated Height-Max:
1.2 mm
Supply Voltage-Max (Vsup):
40 V
Supply Voltage-Min (Vsup):
11.8 V
Supply Voltage-Nom (Vsup):
13.5 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
4.4 mm
NCV48920PA50R2G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
The recommended soldering conditions for NCV48920PA50R2G are a peak temperature of 260°C, a dwell time of 30-60 seconds, and a soldering process that follows the IPC J-STD-020D standard.
To troubleshoot issues related to overvoltage protection, check the input voltage levels, ensure that the device is properly configured, and verify that the overvoltage protection threshold is set correctly. Also, check for any signs of physical damage or electrical overstress.
The recommended input capacitor selection for NCV48920PA50R2G involves choosing a capacitor with a suitable voltage rating, capacitance value, and ESR. A ceramic capacitor with an X7R or X5R dielectric and a voltage rating of at least 50V is recommended.
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NCV48920PA50R2G Overview
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