NCV553SQ30T1G footprint, schematic symbol and 3D model by onsemi

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NCV553SQ30T1G - onsemi PCB footprint - Other - Other - SC−82AB CASE 419C−02 ISSUE F

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Part Number NCV553SQ30T1G
Manufacturer onsemi
Pin Count 4
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - SC−82AB CASE 419C−02 ISSUE F
Released Date Feb 23, 2019
Last Modified Date Jan 22, 2025 4:53 PM UTC
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NCV553SQ30T1G Details

Manufacturer Part Number:
NCV553SQ30T1G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SC-82AB-4
Manufacturer Package Code:
419C-02
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
8 Weeks
Manufacturer:
onsemi
YTEOL:
5.8
Adjustability:
FIXED
Dropout Voltage1-Max:
1 V
Dropout Voltage1-Nom:
0.65 V
Input Voltage Absolute-Max:
12 V
Input Voltage-Max:
12 V
Input Voltage-Min:
4 V
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Length:
2 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
4
Operating Temperature TJ-Max:
125 °C
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current1-Max:
0.08 A
Output Voltage1-Max:
3.06 V
Output Voltage1-Min:
2.94 V
Output Voltage1-Nom:
3 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSOP
Package Equivalence Code:
SOP4,.08,51
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Regulator Type:
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Screening Level:
AEC-Q100
Seated Height-Max:
1.1 mm
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
1.3 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tolerance-Max:
2%
Width:
1.25 mm

NCV553SQ30T1G Frequently Asked Questions (FAQs)

The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
The recommended soldering conditions for NCV553SQ30T1G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. It's also important to follow the recommended soldering profile and use a solder with a melting point above 217°C.
Yes, the NCV553SQ30T1G can be used in switching regulator applications. However, it's essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range. Additionally, proper layout and decoupling are crucial to minimize electromagnetic interference (EMI).
The recommended input capacitor value and type for NCV553SQ30T1G depend on the specific application and operating conditions. A general guideline is to use a low-ESR ceramic capacitor with a value between 1-10 μF, and a voltage rating that exceeds the maximum input voltage.

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