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NCV59744MNADJTBG - onsemi

Description: Fast Transient Response; Programmable Soft-Start; Open Drain Power Good Output; Stable with Any Type of Output Capacitor; 115mV typical dropout at the full 3.0 A load; 0.8V to 3.6V Output Voltage Range

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NCV59744MNADJTBG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN20 5x5, 0.65P CASE 485DB ISSUE O
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NCV59744MNADJTBG - onsemi  - 3D model - Quad Flat No-Lead - QFN20 5x5, 0.65P CASE 485DB ISSUE O
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NCV59744MNADJTBG Details

  • Manufacturer Part Number:

    NCV59744MNADJTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN-20

  • Package Description:

    QFN-20

  • Manufacturer Package Code:

    485DB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Date Of Intro:

    2019-06-17

  • Manufacturer:

    onsemi

  • YTEOL:

    8.3

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.195 V

  • Dropout Voltage1-Nom:

    0.115 V

  • JESD-30 Code:

    S-XQCC-N20

  • Length:

    5 mm

  • Line Regulation-Max (%/V):

    0.0006

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    20

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Voltage1-Max:

    3.6 V

  • Output Voltage1-Min:

    0.796 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.20SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

NCV59744MNADJTBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a thermal shield or heat spreader to reduce thermal resistance.
  • Critical timing parameters include the clock frequency, clock duty cycle, and setup/hold times. Ensure proper synchronization by using a clock signal with a stable frequency and duty cycle, and by meeting the setup and hold time requirements specified in the datasheet.
  • Use proper PCB layout techniques, such as separating analog and digital circuits, using shielding, and minimizing loop areas. Also, ensure that the device is properly decoupled and that the power supply is well-regulated to reduce EMI emissions.
  • Use a high-impedance probe or a differential probe to measure signals, and ensure that the measurement equipment is properly calibrated. Also, use a signal generator or a function generator to provide a stable input signal, and follow the recommended test procedures outlined in the datasheet.

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NCV59744MNADJTBG Overview

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