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NCV70514MW003BR2G - onsemi

Description: Dual H−bridge for 2−phase Stepper Motors; Programmable Peak−current up to 800 mA; On−chip Current Translator; SPI Interface with Daisy Chain Capability; 7 Step Modes from Full−step up to 32 Micro−steps; Fully Integrated Current−sensing and Current−regulation; On Chip Stall Detection; PWM Current Control with Automatic Selection of Fast and Slow Decay; Fixed PWM Frequency; Active Fly−back Diodes; Full Output Protection and Diagnosis; Thermal Warning and Shutdown; Compatible with 3.3 V Microcontrollers, 5 V T

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NCV70514MW003BR2G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFNW32 5x5, 0.5P CASE 484AB ISSUE D
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NCV70514MW003BR2G - onsemi  - 3D model - Quad Flat No-Lead - QFNW32 5x5, 0.5P CASE 484AB ISSUE D
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NCV70514MW003BR2G Details

  • Manufacturer Part Number:

    NCV70514MW003BR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFNW-32

  • Manufacturer Package Code:

    484AB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-03-06

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    145 °C

  • Operating Temperature-Min:

    -45 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    29 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    14 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

NCV70514MW003BR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
  • The recommended soldering conditions for NCV70514MW003BR2G include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
  • To troubleshoot issues related to overvoltage protection, check the input voltage levels, ensure that the device is properly configured, and verify that the overvoltage protection threshold is set correctly. Also, check for any signs of physical damage or electrical overstress.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and increased risk of failure. It's essential to follow the recommended operating conditions to ensure reliable operation and to avoid voiding the device's warranty.

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NCV70514MW003BR2G Overview

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