Description:Dual H−bridge for 2−phase Stepper Motors; Programmable Peak−current up to 800 mA; Low Temperature Boost Current up to 1100 mA; On−chip Current Translator; SPI Interface; 5 Step Modes from Full−step up to 16 Micro−steps; Fully Integrated Current−sensing and Current−regulation; PWM Current Control with Automatic Selection of Fast and Slow Decay; Fixed PWM Frequency; Active Fly−back Diodes; Thermal Warning and Shutdown; Compatible with 3.3 V Microcontrollers, 5 V Tolerant Inputs, 5 V Tolerant Open Drain Output
The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
Yes, the NCV70516MW1AR2G is qualified for automotive and high-reliability applications, meeting the requirements of AEC-Q100 and other relevant industry standards. However, it's essential to consult with onsemi's application engineers to ensure that the device meets the specific requirements of your application.
To troubleshoot issues related to OVP or UVLO, start by verifying the input voltage and ensuring it's within the recommended range. Check the device's pinouts and connections, and consult the datasheet for specific guidance on troubleshooting these features.
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NCV70516MW1AR2G Overview
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