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NCV7321MW2R2G - onsemi

Description: LIN compliant to specification revision 2.x (backwards compatible to version 1.3) and J2602; Bus voltage ±45 V; Transmission rate 1 kbps to 20 kbps; Thermal shutdown; Indefinite short-circuit protection on pins LIN and WAKE towards supply and ground; Bus pins protected against transients in an automotive environment; Integrated slope control; Normal, Sleep and Stand-By modes

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PCB Footprints
NCV7321MW2R2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8, 3x3, 0.65P CASE 506DG ISSUE A
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3D Models
NCV7321MW2R2G - onsemi  - 3D model - Small Outline No-lead - DFN8, 3x3, 0.65P CASE 506DG ISSUE A
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NCV7321MW2R2G Details

  • Manufacturer Part Number:

    NCV7321MW2R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    506DG

  • Country Of Origin:

    Thailand

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV7321MW2R2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the PCB.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and consider using a heat sink with a high thermal conductivity. Also, follow the recommended operating conditions and derating guidelines.
  • The NCV7321MW2R2G has built-in ESD protection diodes, but it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and avoid voltage spikes or transients.
  • Yes, the NCV7321MW2R2G is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions, and consider additional testing and validation for your specific application.
  • Use a systematic approach to troubleshoot, starting with a review of the PCB layout, component selection, and soldering quality. Check for voltage and current stresses, thermal issues, and ensure that the device is operated within the recommended conditions. Consult the datasheet and application notes for guidance.

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NCV7321MW2R2G Overview

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