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NCV7327D10R2G - onsemi

Description: LIN−Bus Transceiver ♦ Compliant to ISO 17987−4 (Backwards Compatible to LIN Specification rev. 2.x, 1.3) and SAE J2602 ♦ Bus Voltage ?42 V ♦ Transmission Rate up to 20 kbps (No low limit due to absence of TxD Timeout function) ♦ Integrated Slope Control; Protection ♦ Thermal Shutdown ♦ Undervoltage Protection ♦ Bus Pins Protected Against Transients in an Automotive Environment; Modes ♦ Normal Mode: LIN Transceiver Enabled, Communication via the Bus is Possible ♦ Sleep Mode: LIN Transceiver Disabled, the Con

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NCV7327D10R2G Details

  • Manufacturer Part Number:

    NCV7327D10R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2019-01-07

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV7327D10R2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider using a heat sink if necessary. Additionally, ensure that the device is not exposed to temperatures above the recommended maximum junction temperature (Tj) of 150°C.
  • The NCV7327D10R2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. It's also recommended to use ESD protection devices on the input and output pins to prevent damage from electrostatic discharge.
  • To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, ensure that the enable pin is properly biased, and verify that the output voltage is within the specified range. Also, check for any short circuits or overload conditions that may be preventing the device from operating correctly.
  • When paralleling multiple devices for higher current output, ensure that each device has its own input capacitor and that the output capacitors are properly sized to handle the increased current. Additionally, ensure that the devices are properly synchronized and that the output voltage is properly regulated.

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