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NCV7327MW0R2G - onsemi

Description: LIN−Bus Transceiver ♦ Compliant to ISO 17987−4 (Backwards Compatible to LIN Specification rev. 2.x, 1.3) and SAE J2602 ♦ Bus Voltage ?42 V ♦ Transmission Rate up to 20 kbps (No low limit due to absence of TxD Timeout function) ♦ Integrated Slope Control; Protection ♦ Thermal Shutdown ♦ Undervoltage Protection ♦ Bus Pins Protected Against Transients in an Automotive Environment; Modes ♦ Normal Mode: LIN Transceiver Enabled, Communication via the Bus is Possible ♦ Sleep Mode: LIN Transceiver Disabled, the Con

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NCV7327MW0R2G - onsemi - PCB symbol
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NCV7327MW0R2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW8
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NCV7327MW0R2G - onsemi - 3D model - Small Outline No-lead - DFNW8
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NCV7327MW0R2G Details

  • Manufacturer Part Number:

    NCV7327MW0R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    DFNW-8

  • Manufacturer Package Code:

    507AB

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2019-01-07

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NCV7327MW0R2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capabilities at high temperatures.
  • The NCV7327MW0R2G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and follow the recommended operating conditions.
  • Yes, the NCV7327MW0R2G is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions, and consult with onsemi's application engineers for specific requirements and guidelines.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal management, and power supply quality. Use oscilloscopes and logic analyzers to debug the issue. If the problem persists, contact onsemi's technical support for further assistance.

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NCV7327MW0R2G Overview

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