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NCV7341D20R2G - onsemi

Description: ON Semiconductor NCV7341D20R2G, CAN Transceiver 1-channel, 14-Pin SOIC

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NCV7341D20R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 14 CASE 751AP ISSUE A (inches to mm)
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NCV7341D20R2G - onsemi  - 3D model - Small Outline Packages - SOIC 14 CASE 751AP ISSUE A (inches to mm)
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NCV7341D20R2G Details

  • Manufacturer Part Number:

    NCV7341D20R2G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    751AP

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.6868 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7272 mm

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.937 mm

NCV7341D20R2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within its specified temperature range (up to 150°C for the NCV7341D20R2G). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
  • For EMI filtering and shielding, use a common-mode choke or a ferrite bead in series with the input voltage to reduce electromagnetic interference (EMI). Add capacitors in parallel with the input voltage to filter out high-frequency noise. Use a shielded enclosure or a metal can to enclose the device and reduce radiated emissions.
  • Select an input capacitor with a suitable voltage rating, capacitance value, and ESR (equivalent series resistance) for the NCV7341D20R2G. A ceramic or film capacitor with a capacitance value between 1-10 μF and a voltage rating of at least 2x the input voltage is recommended. Ensure the capacitor is placed close to the device's input pins.
  • For PCB assembly and soldering, use a soldering iron with a temperature-controlled tip to prevent overheating the device. Use a solder with a melting point below 220°C to prevent damage to the device. Ensure the PCB is clean and free of contaminants, and use a solder mask to prevent solder bridging.

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